It provides wafer alignment technology of manufacturing equipment and production process
Determines the center location and orientation of the wafer before fine alignment process.
The determination of the orientation of wafer is done by detecting the alignment notch.
Detects the angle of the street on the wafer to orientate accurate angular alignment before fine alignment process.
Feature location tool provides more accurate alignment by detects multiple alignment patterns or circuit patterns on the wafer.
It is possible to perform highly accurate alignment under the most challenging conditions due to the influence of the wafer process.